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CEA-Leti [²Î¿¼ÎÄÏ× 4¡¢5] ÃèÊöÁ˽«¼¯³É Sahara ÏîÄ¿µÄSimcenter Flotherm ÓÃÓÚ 4G µçÐÅÓ¦ÓõÄÒì¹¹Âß¼´îÔØÂß¼ÈýάƬÉÏÍøÂçÒì²½¶àºËÆ÷¼þ£¬°üÀ¨ DFT ºÍÈÝ´íÉè¼Æ¡£
¡° ËùʵÏÖµÄÈÈÄ£Ð;ßÓкܸߵľ«¶È£¬×Çé¿öÏ·ÂÕæÊý¾ÝºÍ²âÁ¿Êý¾ÝÖ®²îµÈÓÚ 3.75%£¬¶ø¿¼ÂÇËùÓÐÈÈ´«¸ÐÆ÷µÄƽ¾ù²îÒìµÍÓÚ 2%¡£¡±? -- Pascal Vivet ²©Ê¿£¬Ñо¿¹¤³Ìʦ£¬CEA-Leti
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1. Floorplan (microelectronics).
http://en.wikipedia.org/wiki/Floorplanning#Floorplanning
2. Physical design (electronics).
http://en.wikipedia.org/wiki/Physical_design_(electronics)
3. Simcenter provides design, verification, thermal and test solutions for TSMC¡¯s CoWoS reference flow, Simcenter press pelease, October 15,2012.
http://www.mentor.com/company/news/mentor-tsmc-cowosreference-flow
4. Pascal Vivet, Yvain Thonnart, Romain Lemaire, Cristiano Santos,?Edith Beign¨¦, Christian Bernard, Florian Darve, Didier Lattard, Ivan?Miro-Panad¨¨s, Denis Dutoit, Fabien Clermidy, S. Cheramy, Abbas?Sheibanyrad, Fr¨¦d¨¦ric P¨¦trot, Eric Flamand, Jean Michailos, Alexandre?Arriordaz, Lee Wang, and Juergen Schloeffel (2017) ¡°A 4¡Á 4 ¡Á 2
homogeneous ccalable 3D network-on-chip circuit with 326 MFlit/s?0.66 pJ/b robust and fault tolerant asynchronous 3D links¡±, IEEE?Journal of Solid State Circuits, Vol. 52 No. 1, pp.33-49.
5. Pascal Vivet. ¡°Multi-scale thermal modeling methodology:?application and exploration of 3D architectures¡±, Simcenter User?Conference, April 2017, Santa Clara, CA.
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